Tacusil® 110020 is a non-solvent based organic resin. This product has the ncharacteristics of high gloss, high hardness, weather resistance and anti-corrosion after hardening, and it also has the ncharacteristics of heat resistance, good dielectric properties and electrical insulation. With excellent storage stability, this resin is applicable for a variety of processing methods, such as immersion, rotary coating and brushing.

Tacusil® 110032 is a one-component joint filling epoxy resin. After curing, it has low shrinkage and good machinability, which can reduce working time and improve working efficiency simultaneously. This product is suitable for sealing a variety of plastics, and can level rapidly during processing, and is not easy to penetrate into the joints during baking. Being able to pass a number of different environmental tests, Tacusil® 110032 has excellent durability. This product has excellent reliability and durability.

Tacusil® 110034 is a one-component joint filling epoxy resin. As a widely used epoxy resin, after curing, this product has low shrinkage and good machinability, which can reduce working time and improve working efficiency simultaneously. This product is applicable to fill the joints of a variety of plastics, and can level rapidly during processing, and is not easy to penetrate into the joints during baking. Being able to pass a number of different environmental tests, Tacusil® 110034 has excellent durability. This product has excellent reliability and durability.

Tacusil® 110041 is a one-component liquid epoxy resin adhesive developed for bonding electronic components. It has good adhesive property after curing. This product is a kind of low temperature curing resin, which is suitable for bonding of various materials, and is better for the bonding of plastics. Being able to pass a number of different environmental tests, Tacusil® 110041 has excellent durability, and is applicable for the bonding of assembly of memory cards and C-MOS as well as thermal components.

Tacusil® 110047 is a one-component epoxy resin adhesive developed for cementing electronic components. This product has good adhesion after hardening. It is a kind of medium-low temperature hardening resin, which is suitable for cementing various materials, and is better for the cementing of plastics. Being able to pass a number of different environmental tests, this resin has excellent durability, and is applicable for the bonding of assembly of memory cards and C-MOS as well as thermal components.

Tacusil® 110051 is a one-component epoxy resin adhesive developed for electronic products. This product can form a tough structure with excellent shear strength, tear strength and impact strength. The resin is applicable to encapsulate electronic products. It has excellent durability, and is able to pass a number of different environmental tests.

Tacusil® 110052 is a one-component joint filling epoxy resin. As a widely used epoxy resin, after curing, this product has low shrinkage and good machinability, which can reduce working time and improve working efficiency simultaneously. This product is applicable to fill the joints of a variety of plastics, and can level rapidly during processing, and is not easy to penetrate into the joints during baking. Being able to pass a number of different environmental tests, it has excellent durability. This product has excellent reliability and durability.

Tacusil® 110060 is a one-component epoxy resin adhesive developed for cementing electronic components. The product is a one-component epoxy resin hardens between 120℃ and 180°C. After hardening, this resin has good adhesion and high Tg, and has good resistance to grease, chemicals and solvents. The product is a kind of high temperature hardening resin, and is applicable for cementing various kind of materials. Being able to pass a number of different environmental tests, this resin has excellent durability, and is suitable for cementing electronic components.

Tacusil® 110079 is a double liquid epoxy resin which can cure rapidly. After hardening, this resin has good adhesion, and has good resistance to grease, chemicals and solvents. The product can be used to cement and fill in the joints of plastics, metals and electronic components. With the ncharacteristics of easy to use and can shorten the manufacturing process, this resin hardens rapidly at room temperature, and is widely used as epoxy resin cement.

Tacusil® EPA0016 is one-part heat cure high build 100% solids epoxy adhesive with high thermal conductivity. This adhesive is designed for application where has requirement for high thermal conductivity, high strength, low shrinkage and CTE. It has good adhesion to versatile substrates, such as metal, ceramic and some engineering plastics.

Tacusil® EPA0126 is one-part heat cure 100% solids epoxy adhesive. It's flowable and long work time under room temperature and designed for small gap potting in Type-C connector. It has good adhesion to versatile substrates, such as metal, ceramic and some engineering plastics.

Tacusil® EPA0134W-2 is a highly filled, high viscosity white adhesive designed for applications requiring a non-sag and a low CTE metal bonding application. It's updated version of EPA0134W in long work time and size stability in curing process. This formula gives excellent resistance to acids, bases, water, and most organic compounds. The high filler content also enhances resistance to thermal cycle stresses.

Tacusil® EPA0135G is one-part heat cure 100% solids epoxy adhesive. It's high viscosity and long work time under room temperature and designed for bonding applications with high temperature resistance and impact resistance requirement. It also has good weather resistance and adhesion to versatile substrate, such as metals, ceramic and some engineering plastics.

Tacusil® EPA0135M is one-part heat cure 100% solids epoxy adhesive. It's flowable and long work time under room temperature and designed for bonding applications with high temperature resistance and impact resistance requirements. It also has excellent dielectric strength and adhesion to versatile substrates, such as metals, ceramic and some engineering plastics.

Tacusil® EPA0139-2 is a two-part, low viscosity epoxy casting resin. It's a general purpose, 4:1 by weight mix ratio formulated resin with medium exotherm. It's updated version of EPA0139 in longer work time and cures under room temperature within 24hours, it exhibits good bonding strength to lots of substrates and excellent chemical resistance to many kinds of solvents.

Tacusil® EPA0145 is a two-part general purpose potting epoxy. It has good adhesion to versatile substrates and good resistance to chemical solvents and mechanical impact. It also has long time weather resistance and can supply excellent protection to PCBA and electronical components. This adhesive has a white version.

Tacusil® EPA0168 a single component epoxy with long room temperature pot life. It can cure at relatively low temperatures such as 65℃(20-30 minutes typically) and can cure very quickly at high temperatures such as 90℃(3-4 minutes typically). This epoxy adhesive is flexible and toughened to minimize stresses at the bond-line of CTE mismatched materials and has excellent performance under high mechanical impact.

Tacusil® EPA0180 is 1 two-part very low viscosity general purpose epoxy potting. It's a translucent potting system with adjustable light transmittance and designed for some component potting with special light transmittance. It also has excellent weather resistance, chemical resistance and good adhesin to versatile substrates.

Tacusil® EPA0181LV is one-part heat cure high build 100% solids epoxy adhesive with high thermal conductivity. This adhesive is designed for application where has requirement for high thermal conductivity, high strength, low shrinkage and CTE. It has good adhesion to versatile substrates, such as metal, ceramic and some engineering plastics.

Tacusil® EPA0183 is one-part heat cure 100% solids epoxy adhesive. It's flowable and long work time under room temperature and designed for small area potting application with high temperature resistance and impact resistance requirement. The potted parts can pass 4 times reflow oven and HTHM test (0.6mm thickness 85C + RH85% environment for 1000 hours). It also has excellent dielectric strength and adhesion to versatile substrates, such as metals, ceramic and some engineering plastics.